ANSYS 18 Innovations – Signal Integrity, Power Integrity, EMI
Check new webinar of ANSYS Software products –ANSYS HFSS webinar.
Date –
February 23, 2017, Time – 11:00 AM – 12:00 PM (EST)
Speaker –
Venue:
Online via WebEx
Contact:
webinar@ansys.com
Cost – Free
Link – ANSYS 18 Innovations – Signal Integrity, Power Integrity, EMI
Details –
Attend this webinar to learn how ANSYS 18.0 has enhanced the Chip-Package-System workflow to address design challenges in power integrity, signal integrity, ESD, thermal and structural challenges. Discover how ANSYS solutions provide a unique virtual prototyping flow to simulate the electrical, thermal, and mechanical behaviors of high-speed electronics, allowing you to meet your system power and performance targets while reducing cost.
Description
ANSYS 18.0 delivers new key functionalities for high-speed digital design.
The powerful new 3-D assembly capability in ANSYS HFSS links ECAD and MCAD with transient circuit simulation and IC models, so you can solve the ‘Connector on Board’ problem within a single design flow using a single mesh.
ANSYS SIwave features fast extraction technology, new high-performance computing (HPC) functionality for capacity and speed, and support for PSPICE Voltage Regulator Modules. SIwave also includes enhancements in IBIS-AMI, eye analysis, and state-space fitting within the circuit solver.
