Electronics Thermal Management Using ANSYS Icepak: A Hands-On Workshop

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Check new Seminar of ANSYS Software products – ANSYS, ANSYS Icepak, Icepak Seminar.

Date – April 25, 2017, Time – 11:00 AM – 3:00 PM (PDT)

Speaker – Verly Flores ( verly.flores@ansys.com )

Cost – Free

Link –

Electronics Thermal Management Using ANSYS Icepak: A Hands-On Workshop

Details –

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Thermal management in electronics requires that temperatures of all components be maintained within a safe operating range. The engineering of thermal performance is no longer limited to a single device and its primary cooling mechanism alone, but often involves many other parts in the system — a neighboring package, a distant fan, or a chassis sheet metal. In addition, multi-physics coupling considerations are required to fully account for the electro-thermal and thermo-mechanical effects on the design.

ANSYS Icepak is a powerful thermal analysis CFD tool that allows engineers to model complex electronic systems, and perform heat transfer and fluid flow simulations on component-level, board-level or system-level applications. The ability to import and modify MCAD and ECAD geometry, coupled with extensive multi-physics capabilities, as well as accurate body fitted meshing, make Icepak the tool of choice when sign-off accuracy is required.

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About Seminar –

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Join ANSYS for a free hands-on “Lunch & Learn” workshop for an overview of ANSYS Icepak. This workshop is designed to provide a panoramic feel of the ANSYS Icepak workflow.

Please note that the hands-on session limits registration to 12 attendees.

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