Check new Seminar of ANSYS Software products – ANSYS, ANSYS Mechanical, ANSYS Mechanical Seminar.
Date – April 25, 2017, Time – 11:00 AM – 2:00 PM (PDT)
Venue – ANSYS, Inc., 2645 Zanker Road, San Jose, CA 95134, USA
Speaker – Verly Flores ( firstname.lastname@example.org )
Cost – Free
Join ANSYS for a free, hands-on, “Lunch & Learn” workshop focusing on PCB Mechanical Reliability. Attendees will learn how to create mechanical models of electronics components, such as PCBs, using state-of-the-art best practices and new product features, such as Trace Mapping. Attendees will be guided through the ANSYS Mechanical workflow starting with the import of ECAD geometry through the running of thermal and structural simulations that result in the generation of mechanical deformations, stresses, and strains. In addition, attendees will learn how to perform solder-joint fatigue calculations to determine the fatigue life of solder balls in an electronics assembly. The objective of the session is to introduce engineers to the workflows and simulations required to leverage ANSYS Mechanical in the performance of electronics reliability assessments. Whether you are new to simulation or an expert ANSYS Mechanical user, this workshop will be valuable to learn about the latest technologies and best practices.
About Seminar –
This seminar will include hands-on exercises for performing Thermal-Stress analyses of a PCB with components.
This workshop will feature the following:
- Import of ECAD data into the ANSYS Workbench Environment.
- Use of the Trace Mapping feature in ANSYS Mechanical to speed-up the model creation and simulation process, while ensuring accurate results.
- Define model parameters and perform a steady-state thermal analysis.
- Perform a thermal-stress analysis to determine critically-stressed regions.
- Calculate the number of cycles to crack initiation and failure for the solder balls in the assembly.
Please note that the hands-on session limits registration to 12 attendees.