Electronics Thermal Management Using ANSYS Icepak: A Hands-On Workshop
Check new Seminar of ANSYS Software products – ANSYS , Icepak, ANSYS Icepak Seminar.
Date – May 9, 2017, Time – 10:00 AM – 2:00 PM (EST)
Venue – Cypress Center One, 5404 Cypress Center Drive, Suite #125, Tampa, FL 33609-1043, USA
Speaker – Anthony Williams ( anthony.williams@ansys.com )
Cost – Free
Link –
Electronics Thermal Management Using ANSYS Icepak: A Hands-On Workshop
Details –
Thermal management in electronics requires that temperatures of all components be maintained within a safe operating range. The engineering of thermal performance is no longer limited to a single device and its primary cooling mechanism alone, but often involves many other parts in the system — a neighboring package, a distant fan, or a chassis sheet metal. In addition, multi-physics coupling considerations are required to fully account for the electro-thermal and thermo-mechanical effects on the design.
ANSYS Icepak is a powerful thermal analysis CFD tool that allows engineers to model complex electronic systems, and perform heat transfer and fluid flow simulations on component-level, board-level or system-level applications. The ability to import and modify MCAD and ECAD geometry, coupled with extensive multi-physics capabilities, as well as accurate body fitted meshing, make Icepak the tool of choice when sign-off accuracy is required.
About Seminar –
Join ANSYS for a free hands-on “Lunch & Learn” workshop for an overview of ANSYS Icepak. This workshop is designed to provide a panoramic feel of the ANSYS Icepak workflow.
Please note that the hands-on session limits registration to 12 attendees. Lunch will be provided.
