Check new Seminar of ANSYS Software products – ANSYS, ANSYS HFSS Seminar.
Date – May 18, 2017, Time – 9:00 AM – 2:00 PM (MDT)
Venue – Phoenix Analysis & Design Technologies (PADT), 7755 S Research Drive, Tempe,AZ 85284, USA
Speaker – Andy Bauer ( email@example.com )
Cost – Free
Join ANSYS for a free hands-on “Lunch & Learn” that demonstrates the fully automated 3-D electrical layout interface enabled in ANSYS HFSS R18. As a complement to the traditional arbitrary 3-D CAD-based modeling interface, the ANSYS HFSS 3-D Layout interface is a significant productivity enhancement for IC Package and PCB designers. ANSYS HFSS 3-D Layout allows engineers to easily create fully parametric models and perform design studies of printed circuit boards (PCB), electronic Packages and custom integrated circuits. In addition, the built-in parametric interface enables design engineers to explore design alternatives and evaluate design trade-offs prior to fabrication.
About Seminar –
The hands on exercises will demonstrate how to Perform a High-Frequency Signal Integrity simulation on a PCB and Package including:
- Import board/package design file and choose nets to analyze
- Validate stackup and Auto creation of ports, boundaries and setup solution parameters
- Setup HPC options, solve the project and view Results