Engineering Simulation for Electronics and Electrical Product Design
Check new Seminar of ANSYS Software products – ANSYS, ANSYS Maxwell, Maxwell Seminar.
Date – August 11, 2017, Time – 9:15 AM – 5:00 PM (IST)
Venue – Novotel Hotel, Weikfield IT City Infopark, Survey No 30/3, Viman Nagar Road, Ramwadi, Pune, Maharashtra 411014, India
Speaker – india-events@ansys.com
Cost – Free
Link – Engineering Simulation for Electronics and Electrical Product Design
Details –
Perhaps no engineering discipline faces greater pressure to drive ongoing innovation than electronics and electrical. Device miniaturization, support for multiple wireless technologies, faster data rates, longer battery life – for example demand rigorous analysis.
Join us at the seminar where industry experts and our simulation experts take you to through a journey of simulation based product design from component to sub system and complete systems.
About Seminar –
Highlights of talks
- Electromagnetic Interference and Compatibility (EMI/EMC): Tackling the complex problems of conducted and radiated emissions through proven simulation technologies which helps to reduce the physical prototyping to design a system for EMC certification.
- Automotive Electrification: Current trends and future technologies in automotive electrification. Learn how simulation is adopted in the design of different components of electric vehicles including design of electro-mechanical devices, power electronics, battery and complete EV drive system.
- PCB Electromagnetic and Thermal Reliability: Learn how Signal and Power integrity of the PCBs can be ensured through simulation. Analyze the thermal and structural reliability of the PCBs for increasing energy density demands.
Agenda
Welcome Note |
Electronics Component and System Design using Engineering Simulation |
Tea Break and networking |
Keynote Talk: Automotive Electrification |
Electromechanical and Power electronics Design with ANSYS Maxwell |
Lunch Break and networking |
Board reliability for Signal and Power Integrity |
PCB Thermal and Structural reliability |
Tea Break and networking |
Tackling EMI/EMC with ANSYS Simulations |
RF and Antenna Design |