Engineering Simulation for Electronics and Electrical Product Design

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Check new Seminar of ANSYS Software products – ANSYS, ANSYS Maxwell,  Maxwell Seminar.

Date –  August 11, 2017, Time – 9:15 AM – 5:00 PM (IST)

Venue – Novotel Hotel, Weikfield IT City Infopark, Survey No 30/3, Viman Nagar Road, Ramwadi, Pune, Maharashtra 411014, India

Speaker – india-events@ansys.com

Cost – Free

Link – Engineering Simulation for Electronics and Electrical Product Design

Details –

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Perhaps no engineering discipline faces greater pressure to drive ongoing innovation than electronics and electrical. Device miniaturization, support for multiple wireless technologies, faster data rates, longer battery life – for example demand rigorous analysis.

Join us at the seminar where industry experts and our simulation experts take you to through a journey of simulation based product design from component to sub system and complete systems.

About Seminar –

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Highlights of talks

  • Electromagnetic Interference and Compatibility (EMI/EMC): Tackling the complex problems of conducted and radiated emissions through proven simulation technologies which helps to reduce the physical prototyping to design a system for EMC certification.
  • Automotive Electrification: Current trends and future technologies in automotive electrification.  Learn how simulation is adopted in the design of different components of electric vehicles including design of electro-mechanical devices, power electronics, battery and complete EV drive system.
  • PCB Electromagnetic and Thermal Reliability: Learn how Signal and Power integrity of the PCBs can be ensured through simulation. Analyze the thermal and structural reliability of the PCBs for increasing energy density demands.

Agenda

 Welcome Note
 Electronics Component and System Design using Engineering Simulation
 Tea Break and networking
 Keynote Talk: Automotive Electrification
 Electromechanical and Power electronics Design with ANSYS Maxwell
 Lunch Break and networking
 Board reliability for Signal and Power Integrity
 PCB Thermal and Structural reliability
 Tea Break and networking
 Tackling EMI/EMC with ANSYS Simulations
 RF and Antenna Design
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