Thermal, EM and ESD Reliability Signoff for Next Generation FinFET Designs

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Check new webinar of ANSYS Software products – ANSYS, ANSYS PathFinder, PathFinder,  Thermal, Electromigration (EM), Electrostatic Discharge (ESD), ESD, EM, Webinar.

Date – September 27, 2017

Speaker – Online via WebEx (webinar@ansys.com)

Cost – Free

Link – Thermal, EM and ESD Reliability Signoff for Next Generation FinFET Designs

Details –

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This webinar highlights the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge (ESD) robustness in advanced SoCs. Providing high reliability is critical for next-generation automotive, mobile and high-performance computing applications; it can be addressed in a systematic way using ANSYS reliability platforms throughout the design cycle.

 

About webinar –

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Join us to learn how ANSYS solutions offer comprehensive chip-package-system thermal analysis, as well as thermal aware EM sign-off, for finFET designs. Discover how ANSYS PathFinder can help ensure ESD integrity from the IO/IP level to the SoC for human body model (HBM) and charged device model (CDM) analysis. This session will also cover best practices for ESD model hand-off from IP to SoC for chip ESD validation, and generating SoC-level ESD models for system-level ESD simulations.

 

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