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Category: Conference

22 Posts

architecture developments, Arm community, Arm TechCon 2017, Arm TechCon 2017 Conference/Expo, Arm TechCon Conference/Expo, Arm technologies, Arm® TechCon, Automotive, Industrial & Functional Safety, battery life maximization, Breaking News, Cloud, cloud platform, communications protocols, Compilation Tools Languages, Computer Vision, Computer Vision, Machine Learning & Graphics, Conference, debug, digital data sources, digital signals, distributed analytics, eight-track program, Embedded Software Development, energy harvesting, engineering, Engineering Managers, Engineers, executive managers, Expert Experience Levels, exploit productive, Graphics, hardware engineers, heterogeneous systems, High-Efficiency Systems, high-performance, Innovation, innovative, Internet of Things, Internet of Things (IoT), Latest News, Linux/Android operating systems, machine learning algorithms, methodologies, Methodology, multicore software, Networking, Networking & Servers, performance tuning, processing methodologies, Protocols, Santa Clara, Santa Clara, California, United States, Servers, Silicon Design, software developers, software development, software subsystems, storage server platforms, Trust & Security, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, wearables systems design

Arm TechCon 2017 Conference/Expo – October 24, 2017 – October 26, 2017, Santa Clara, California, United States

October 25, 2017 — 0 Comments

20th Annual Systems Engineering Conference, academic, application, applications, Association, Breaking News, Chief Scientists, Communities, Conference, Defense Programs, Design Verification, Electronic Systems Society, energy, engineering, Engineering Managers, Engineers, function, IEEE Aerospace, IEEE Systems Council, Industrial Association, Industry Leaders, Infrastructure, Innovation, innovative, Innovative Tactics, interactions, International Council on Systems Engineering, Latest News, Logistics, National Defense Industrial Association, NDIA, NDIA’s Annual Systems Engineering Conference, practical, Pragmatic, Program Managers, Project Managers, researchers, Springfield, Springfield,  Virginia, subsystems, Support, system level design, Systems Engineering, Systems Engineering Conference, Systems Engineers, Tactics, technology, Test, Test Communities, United States, Upcoming Conference, verification, Virginia, Warfighting Force

20th Annual Systems Engineering Conference – October 23, 2017 – October 26, 2017, Springfield, Virginia, United States

October 25, 2017 — 0 Comments

(DAC 2017), 21 billion transistors, AI, Analysis, ANSYS, ANSYS 18, ANSYS RedHawk Webinar, ANSYS RedHawk-SC, ANSYS Simulation, ANSYS Simulations, ANSYS webinar, application, Big Data, big data solution, Breaking News, CAD, CAE, CAE analysts, CAE-based design points, CAE/CAD Integration, complexity, Computational Electromagnetics, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Conference, critical, cutting-edge AI, Design Automation Conference, Design Automation Conference 2017, Design Automation Conference 2017 (DAC 2017), designs, developers, efficiency, Electronic Devices (ED), Electronics, Electronics 18.0 simulations, energy, engineering, engineering simulation, engineering simulations, Engineers, FEA, finite element analysis, finite element analysis (FEA), full-chip power integrity, geometry, high-performance, high-performance computing (HPC), IP track, Machine Learning, machine learning applications, Measurement Results,, Methodology, NVIDIA, NVIDIA GPUs, NVIDIA’s Largest GPU – Volta, Powerful GPU, precision, predictions, Predictive Thermal Design, product design, RedHawk, RedHawk-SC, Sensor, Sensor Developers, sensors, Silicon, silicon correlation exercises, Silicon Measurement, silicon measurement results, Simulated Voltage Values, simulation, simulation data, SoC, SoC Power Signoff, SoC power signoff solution, transistors, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming FEA Webinar, Upcoming Webinar, virtual prototyping,, virtual validation, Volta chip, webinar

High Capacity Power Signoff Using Big Data Webinar – November 14, 2017

October 22, 2017 — 0 Comments

ANSYS, ANSYS AIM, ANSYS Aqwa, ANSYS Convergence Conference, ANSYS Convergence Regional Conference, ANSYS Convergence Regional Conference 2017, ANSYS Electronics Desktop, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, ANSYS Workbench, Aqwa, autonomous vehicles, battery modeling, battery technology, Bengaluru, India, Breaking News, CAD, CAE, CAE-based design points, CAM, CFD, CFD simulation, CFD simulation tool, chemical, Chip to Product, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, electrical, Electrical CAD (ECAD), Electrical Engineers, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, energy, engineering, engineering simulation, EnSight, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Flow generation, Fluid interface manipulation, half-billion cell models, high-performance, high-performance computing (HPC), Icepak, Latest News, Mechanical, Mechanical CAD (MCAD), mechanical engineers, medical applications, Medical Devices, MULTIPHYSICS, optiSLang, precision, Predictive Thermal Design, product design, Product Lifecycle Management, Product Lifecycle Management (PLM), Robust Design Optimization, Robust Design Optimization (RDO), simulation, software subsystems, Space, subsystems, system level design, transducer designs, Upcoming ANSYS Conference, Upcoming Conference

ANSYS Convergence Regional Conference 2017 – August 31, 2017, Bengaluru, India

August 29, 2017 — 0 Comments

14th Conference on Acoustofluidics, Acoustic, Acoustic Analysis, Acoustic Experimentation, Acoustic streaming, acoustofluidics, Acoustofluidics 2017, Acoustofluidics 2017 Conference, biological, Breaking News, bubble manipulation, CAE, CAE-based design points, California, CBMS, CFD, CFD simulation, CFD simulation tool, chemical, Chip to Product, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, Electronic Devices (ED), Electronics, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Flow generation, Flow generation mechanisms, Fluid interface manipulation, high-performance, high-performance computing (HPC), HPC, Latest News, Measuring Acoustic Waves,, medical applications, Microscale, Microscale acoustofluidics, MULTIPHYSICS, Nanoscale, Nanoscale acoustofluidics, Particle Manipulation, Predictive Thermal Design, product design, Robust Design Optimization, San Diego, San Diego, California, San Diego, California, United States, simulation, transducer designs, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming Conference

Acoustofluidics 2017 Conference – The 14th Conference on Acoustofluidics – August 28, 2017 – August 29, 2017 , San Diego, California, United States

August 29, 2017 — 0 Comments

ANSYS, ANSYS optiSLang, ANSYS optiSLang Seminar, ANSYS Seminar., Archive News, Archived Conference, Archived Seminar, Archived Seminar/Workshop, CAE, CAE-based design points, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Conference, congress centrum neue weimarhalle, Dynardo, Dynardo - dynamic software & engineering, FEA, finite element analysis, finite element analysis (FEA), Germany, optiSLang, optiSLang Seminar, Seminar building, UNESCO-Platz 1, Weimar, Germany, WORKSHOP

Weimar Optimization and Stochastic Days 2017 Conference – June 1, 2017 – June 2, 2017, Weimar, Germany

May 29, 2017 — 0 Comments

3D Manufacturing, 3D Printer, 3D printing, Additive Manufacturing, Additive Manufacturing Conference, Atlantic Design & Manufacturing, Atlantic Design & Manufacturing Trade Show/EXPO & Conference, Breaking News, Conference, Enthusiasts, Jacob K. Javits Convention Center, Jacob K. Javits Convention Center, New York, NY, Latest News, materials handling, New York, NY, rapid prototyping, sensors, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, Upcoming Workshop, WORKSHOP

Atlantic Design & Manufacturing Trade Show/EXPO & Conference – June 13, 2017 – June 15, 2017, New York City, New York, United States

May 25, 2017 — 0 Comments

ANSYS, ANSYS Aqwa, ANSYS Aqwa Seminar, ANSYS Seminar., Aqwa, Breaking News, CAE, COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Conference, FEA, finite element analysis, finite element analysis (FEA), Houston, Houston, Texas, United States, Latest News, Seminar, Texas, Texas, United States, United States, Upcoming ANSYS Aqwa Seminar, Upcoming ANSYS Seminar, Upcoming Seminar, Upcoming Seminar/Workshop

Analysis and Hydrodynamic Assessment of Offshore and Marine Structures Using ANSYS Aqwa Seminar – May 25, 2017, Houston, Texas, United States

May 23, 2017 — 0 Comments

ANSYS, ANSYS AIM, ANSYS Electronics Desktop, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MECHANICAL, ANSYS Savant, ANSYS SpaceClaim, ANSYS SpaceClaim Direct Modeler, Breaking News, CAE, COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Conference, FEA, finite element analysis, finite element analysis (FEA), Latest News, Lynnwood, Lynnwood, Washington, Lynnwood, Washington, United States, United States, Upcoming ANSYS Conference, Upcoming Conference

ANSYS Pacific Northwest Innovation Conference – May 23, 2017, Lynnwood, Washington, United States

May 22, 2017 — 0 Comments

Boston, Boston, Massachusetts, Boston, Massachusetts, United States, Breaking News, CAD, CAE, CAM, CFD, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, FEA, finite element analysis, finite element analysis (FEA), Latest News, PLM, Product Lifecycle Management, Product Lifecycle Management (PLM), United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, WORKSHOP

LiveWorx 2017 Conference – May 22, 2017 – May 25, 2017,Boston, Massachusetts, United States

May 22, 2017 — 0 Comments

Breaking News, Conference, Florida, IEEE International Electric Machines & Drives, IEEE International Electric Machines & Drives Conference, IEMDC 2017, IEMDC 2017 Conference, Latest News, Miami, Miami, Florida, Miami, Florida, United States, Trade Show / Expo, Tradeshows, United States, Upcoming Conference, Upcoming TradeShow, Upcoming TradeShow/EXPO, Upcoming Workshop, WORKSHOP

IEEE International Electric Machines & Drives Conference – May 21, 2017 – May 24, 2017,Miami, Florida, United States

May 15, 2017 — 0 Comments