Category: high-performance

20 Posts

architecture developments, Arm community, Arm TechCon 2017, Arm TechCon 2017 Conference/Expo, Arm TechCon Conference/Expo, Arm technologies, Arm® TechCon, Automotive, Industrial & Functional Safety, battery life maximization, Breaking News, Cloud, cloud platform, communications protocols, Compilation Tools Languages, Computer Vision, Computer Vision, Machine Learning & Graphics, Conference, debug, digital data sources, digital signals, distributed analytics, eight-track program, Embedded Software Development, energy harvesting, engineering, Engineering Managers, Engineers, executive managers, Expert Experience Levels, exploit productive, Graphics, hardware engineers, heterogeneous systems, High-Efficiency Systems, high-performance, Innovation, innovative, Internet of Things, Internet of Things (IoT), Latest News, Linux/Android operating systems, machine learning algorithms, methodologies, Methodology, multicore software, Networking, Networking & Servers, performance tuning, processing methodologies, Protocols, Santa Clara, Santa Clara, California, United States, Servers, Silicon Design, software developers, software development, software subsystems, storage server platforms, Trust & Security, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, wearables systems design

Arm TechCon 2017 Conference/Expo – October 24, 2017 – October 26, 2017, Santa Clara, California, United States

(DAC 2017), 21 billion transistors, AI, Analysis, ANSYS, ANSYS 18, ANSYS RedHawk Webinar, ANSYS RedHawk-SC, ANSYS Simulation, ANSYS Simulations, ANSYS webinar, application, Big Data, big data solution, Breaking News, CAD, CAE, CAE analysts, CAE-based design points, CAE/CAD Integration, complexity, Computational Electromagnetics, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Conference, critical, cutting-edge AI, Design Automation Conference, Design Automation Conference 2017, Design Automation Conference 2017 (DAC 2017), designs, developers, efficiency, Electronic Devices (ED), Electronics, Electronics 18.0 simulations, energy, engineering, engineering simulation, engineering simulations, Engineers, FEA, finite element analysis, finite element analysis (FEA), full-chip power integrity, geometry, high-performance, high-performance computing (HPC), IP track, Machine Learning, machine learning applications, Measurement Results,, Methodology, NVIDIA, NVIDIA GPUs, NVIDIA’s Largest GPU – Volta, Powerful GPU, precision, predictions, Predictive Thermal Design, product design, RedHawk, RedHawk-SC, Sensor, Sensor Developers, sensors, Silicon, silicon correlation exercises, Silicon Measurement, silicon measurement results, Simulated Voltage Values, simulation, simulation data, SoC, SoC Power Signoff, SoC power signoff solution, transistors, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming FEA Webinar, Upcoming Webinar, virtual prototyping,, virtual validation, Volta chip, webinar

High Capacity Power Signoff Using Big Data Webinar – November 14, 2017

Analysis, ANSYS, ANSYS 18, ANSYS Electronics Desktop, ANSYS HFSS, ANSYS HFSS webinar, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS Maxwell Webinar, ANSYS Multiphysics, ANSYS Simulation, ANSYS Simulations, ANSYS webinar, ANSYS Workbench, antenna, Antenna Applications, Antenna Simulation, Antennas and Propagation (AP), Breaking News, CAD, CAE, CAE analysts, CAE-based design points, CAE/CAD Integration, complexity, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), designs, developers, digital data sources, digital signals, electrical, Electrical CAD (ECAD), Electrical Engineers, Electro-Thermal Analysis, Electromagnetic Compatibility (EMC), Electromagnetics, electromigration, electromigration (EM), Electronic Devices (ED), Electronics, Electronics 18.0 simulations, emissions, energy, engineering, engineering simulation, engineering simulations, FEA, finite element analysis, finite element analysis (FEA), FLUENT, HFSS 18, High Performance RF/Microwave Components, high-performance, MULTIPHYSICS, Multiphysics Webinar, precision, product design, radio frequency interference, radio frequency interference (RFI), RF, RF emissions, RF Module, RF transceivers, RF/microwave components, RFI, RFI issues, simulation, simulation data, solvers, Transceivers, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Interference-Free Design of Electronic Devices Webinar – Tuesday, November 07, 2017

24/7, 24/7 HPC Cloud, Analysis, ANSYS, ANSYS 18, ANSYS FLUENT, ANSYS MECHANICAL, ANSYS Mechanical structural analysis, ANSYS Multiphysics, ANSYS Simulation, ANSYS Simulations, ANSYS webinar, ANSYS Workbench, Breaking News, CAD, CAE, CAE analysts, CAE-based design points, CAE/CAD Integration, CFD, CFD post-processing software, CFD simulation, CFD simulation tool, CFD workflows, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), CPU, CPU 24/7, CPU 24/7 HPC Cloud, designs, efficiency, energy, engineering, Engineering Managers, engineering simulation, engineering simulations, FEA, finite element analysis, finite element analysis (FEA), FLUENT, FLUID DYNAMICS, Fluid interface manipulation, high-performance, high-performance computing (HPC), HPC, HPC Cloud, Mechanical, Mechanical CAD (MCAD), mechanical engineers, mechanical parts, MULTIPHYSICS, product design, rapid prototyping, simulation, simulation data, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming FEA Webinar, Upcoming Webinar, virtual prototyping,, virtual validation, webinar

Free ANSYS Performance Benchmark Program Supported by HPC Partners Webinar – November 7, 2017

Analysis, ANSYS, ANSYS 18, ANSYS FLUENT, ANSYS Fluent Webinar, ANSYS HFSS, ANSYS HFSS webinar, ANSYS MECHANICAL, ANSYS Mechanical structural analysis, ANSYS Multiphysics, ANSYS Simulation, ANSYS Simulations, ANSYS webinar, ANSYS Workbench, Breaking News, CAD, CAE, CAE analysts, CAE-based design points, CFD, CFD post-processing software, CFD simulation, CFD simulation tool, CFD workflows, Cloud, cloud platform, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), CPU, CPU 24/7, CPU 24/7 HPC Cloud, Data Center, data center designs, energy, engineering, Engineering Managers, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), FLUENT, GPU, HFSS 18, high-performance, high-performance computing (HPC), Higher Simulation Productivity, HPC, HPC Cloud, MULTIPHYSICS, Multiphysics Webinar, NVIDIA, parallel solvers, precision, product design, Rescale, simulation, solvers, Upcoming ANSYS Fluent Webinar, Upcoming ANSYS HFSS Seminar, Upcoming ANSYS Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

How to Speed Up ANSYS 18 with NVIDIA GPUs on the Cloud Webinar – Wednesday, October 18, 2017

Adams, Adams Car, Adams MaxFlex, Adams Real Time, Adams Real Time Webinar, Adams real-time vehicle model, ADAS, Advanced Driver Assist Systems, advanced driver assist systems (ADAS), Advanced Driver Assistance Systems, Advanced Driver Assistance Systems (ADAS), Analysis, automated driving simulation, Automotive Manufacturer, autonomous vehicles, Breaking News, CAD, CAE, CAE-based design points, car body, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Design of Experiments, Design of Experiments (DOE), Design of Experiments (DOE) technology, developers, engineering, Engineering Managers, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Hardware-in-the-loop Engineers, high-performance, machine learning techniques, Mechanical, Mechanical CAD (MCAD), mechanical engineers, MSC ADAMS, MSC Adams Car, MSC Adams Car Webinar, MSC Adams software, MSC ADAMS Webinar, MSC's SimManager, OpenCRG, OpenDRIVE, OpenSCENARIO, Project Managers, Sensor, Sensor Developers, Software- and Hardware-in-the-loop Engineers, Software-in-the-loop Engineers, Uncategorized, Vehicle Dynamics, Vehicle Dynamics Analysts, VIRES, VIRES Virtual Test Drive (VTD), Virtual Test Drive (VTD), virtual validation, VTD suite

Introducing VIRES Virtual Test Drive for the Development of Automated Vehicles Webinar – October 18, 2017

Analysis, Breaking News, CAD, CAE, CAE-based design points, CAEfatigue, CAEfatigue Ltd, COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Design of Experiments, Design of Experiments (DOE), DOE, engineering, engineering simulation, Fatigue, Fatigue Analysis, fatigue life, FEA, finite element analysis, finite element analysis (FEA), high-performance, high-performance computing (HPC), High-Performance Racing, HPC, Mechanical, Mechanical CAD (MCAD), mechanical engineers, MSC Nastran, MSC Nastran SOL 400, MSC Nastran SOL 400 Webinar, MSC Nastran Webinar, MSC One, MSC Software, MSC Software Webinar, NEVF, NEVF file, optimization, Optimization Technology, Power Spectral Density, precision, product design, PSDs (Power Spectral Density), Random Response, Random Response analysis, rapid prototyping, Robust Design Optimization, simulation, SOL 400, SOL 400 Webinar, solvers, system level design, technology, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming MSC Nastran, Upcoming MSC Nastran SOL 400, Upcoming MSC Software Webinar, Upcoming SOL 400, Upcoming Webinar, virtual prototyping,, webinar

100x Faster Durability Studies with MSC Nastran Embedded Vibration Fatigue NEVF (MSC Nastran is available in MSC One) Webinar – Thursday, October 5, 2017