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Category: Upcoming Conference

23 Posts

Analysis, ANSYS, ANSYS EnSight, ANSYS EnVision, ANSYS FEA, ANSYS FLUENT, ANSYS MECHANICAL, ANSYS Multiphysics, ANSYS Simulation, ANSYS Simulations, ANSYS Structural, ANSYS Workbench, application, applications, Breaking News, CAD, CAE, CAE analysts, CAE post-processing, CAE-based design points, CAE/CAD Integration, CEI, CEI, Inc., CFD, CFD models, CFD post-processing software, CFD simulation, CFD simulation tool, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, computational fluid dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Design Verification, designs, energy, engineering, engineering data, Engineering Managers, engineering simulation, engineering simulations, Engineers, EnSight 10.2, EnSight Standard, EnVision 10.2, FEA, finite element analysis, finite element analysis (FEA), FLUENT, FLUID DYNAMICS, Fluid interface manipulation, Fluid-Structure Interaction, Higher Simulation Productivity, Japan, Mechanical, Mechanical CAD (MCAD), mechanical engineers, MULTIPHYSICS, Nakano Sunplaza, Tokyo, Japan, Optimization Post-Processing, Post-processing, precision, Precision Machining, product design, simulation, simulation data, strength, structural, Tokyo, Tokyo, Japan, Upcoming Conference, viewports, virtual prototyping,, virtual validation, visualization, Workbench

EnSight Japan User Meeting – October 27, 2017 – Nakano Sunplaza, Tokyo, Japan

October 26, 2017 — 0 Comments

Aerodynamic Designs, Aeromechanical Simulation, Analysis, ANSYS, ANSYS 18, ANSYS AIM, ANSYS Conference, ANSYS Convergence Regional Conferences 2017, Ansys Discovery Live, ANSYS EnSight, ANSYS FEA, ANSYS FLUENT, ANSYS MECHANICAL, ANSYS Multiphysics, ANSYS SCADE, ANSYS Simulation, ANSYS Simulations, ANSYS Users, ANSYS Workbench, application, applications, Boundary Conditions, Breaking News, CAD, CAE, CAE analysts, CAE-based design points, CAE/CAD Integration, CFD, CFD models, CFD post-processing software, CFD simulation, CFD simulation tool, CFD workflows, Chip to Product, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, computational fluid dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Cooling, Cooling System, Design and Control Optimization, designs, DesignXplorer, Eindhoven, Eindhoven, Netherlands, electro-thermal problems, Electromagnetics, Electronic Devices (ED), Electronic Equipment, Electronics, Electronics 18.0 simulations, embedded software, Embedded Software Development, embedded systems, energy, engineering, Engineering Postprocessing, engineering simulation, engineering simulations, Engineers, FEA, finite element analysis, finite element analysis (FEA), Flow generation, FLUENT, FLUID DYNAMICS, Fluid interface manipulation, Flutter Predictions, future product development processes, Higher Simulation Productivity, Innovation, Innovation Platform, innovative, innovators, Latest News, Mechanical, mechanical engineers, mechanical parts, Netherlands, physics, Physics Influence, precision, Predictive Thermal Design, product design, SCADE, simulation, simulation data, software developers, software development, software subsystems, strength, structural, structural integrity simulation, structural optimization, structure behavior, Structure Behaviour, Turbomachinery Blade Design, Upcoming Conference, Upcoming Seminar/Workshop, Upcoming Workshop, Validation Processes, virtual prototyping,, Workbench

ANSYS Convergence Regional Conferences 2017 – October 27, 2017 -Eindhoven, The Netherlands

October 26, 2017 — 0 Comments

Advanced Highway and Traffic Management Technologies, application, applications, Association, automated driving simulation, automated driving systems, automated driving vehicle technology, Automotive Action, Automotive Manufacturer, automotive OEMs, Automotive Testing Expo North America 2017, Automotive, Industrial & Functional Safety, autonomous self-driving vehicles, autonomous vehicle research, Autonomous Vehicle Test & Development Symposium, Autonomous Vehicle Test & Development Symposium USA 2017, autonomous vehicles, Breaking News, car body, Cloud, cloud platform, corporations, designs, developers, driver assistance technologies, driverless vehicle testing, efficiency, embedded software, Embedded Software Development, embedded systems, emissions, energy, engineering, Engineers, Eureka PROMETHEUS Project, Fully Automated Driving Vehicle Technology, Fully Autonomous Self-Driving Vehicles, influence, Infrastructure, Innovation, Innovation Platform, innovative, Innovative Tactics, innovators, Internet of Things, Internet of Things (IoT), Latest News, Networking, Novi, Novi, Michigan, predictions, process management, processing methodologies, product design, software developers, software development, Software Integrations, software subsystems, Sophisticated Testing, Systems Engineers, technology, testing processes, Traffic Technology International magazine, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow/EXPO, Validation Processes

Autonomous Vehicle Test & Development Symposium Conference/EXPO – October 25, 2017 – October 26, 2017 – Novi, Michigan, United States

October 25, 2017 — 0 Comments

architecture developments, Arm community, Arm TechCon 2017, Arm TechCon 2017 Conference/Expo, Arm TechCon Conference/Expo, Arm technologies, Arm® TechCon, Automotive, Industrial & Functional Safety, battery life maximization, Breaking News, Cloud, cloud platform, communications protocols, Compilation Tools Languages, Computer Vision, Computer Vision, Machine Learning & Graphics, Conference, debug, digital data sources, digital signals, distributed analytics, eight-track program, Embedded Software Development, energy harvesting, engineering, Engineering Managers, Engineers, executive managers, Expert Experience Levels, exploit productive, Graphics, hardware engineers, heterogeneous systems, High-Efficiency Systems, high-performance, Innovation, innovative, Internet of Things, Internet of Things (IoT), Latest News, Linux/Android operating systems, machine learning algorithms, methodologies, Methodology, multicore software, Networking, Networking & Servers, performance tuning, processing methodologies, Protocols, Santa Clara, Santa Clara, California, United States, Servers, Silicon Design, software developers, software development, software subsystems, storage server platforms, Trust & Security, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, wearables systems design

Arm TechCon 2017 Conference/Expo – October 24, 2017 – October 26, 2017, Santa Clara, California, United States

October 25, 2017 — 0 Comments

20th Annual Systems Engineering Conference, academic, application, applications, Association, Breaking News, Chief Scientists, Communities, Conference, Defense Programs, Design Verification, Electronic Systems Society, energy, engineering, Engineering Managers, Engineers, function, IEEE Aerospace, IEEE Systems Council, Industrial Association, Industry Leaders, Infrastructure, Innovation, innovative, Innovative Tactics, interactions, International Council on Systems Engineering, Latest News, Logistics, National Defense Industrial Association, NDIA, NDIA’s Annual Systems Engineering Conference, practical, Pragmatic, Program Managers, Project Managers, researchers, Springfield, Springfield,  Virginia, subsystems, Support, system level design, Systems Engineering, Systems Engineering Conference, Systems Engineers, Tactics, technology, Test, Test Communities, United States, Upcoming Conference, verification, Virginia, Warfighting Force

20th Annual Systems Engineering Conference – October 23, 2017 – October 26, 2017, Springfield, Virginia, United States

October 25, 2017 — 0 Comments

Aerodynamics, aerospace, Aerospace Enthusiasts, ANSYS, ANSYS ACT, ANSYS AIM, ANSYS Aqwa, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, Automotive Action, autonomous vehicles, battery modeling, battery technology, Breaking News, CAD, CAE, CAE-based design points, CFD, CFD simulation, CFD simulation tool, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), digital twins, electrical, Electrical Engineers, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, energy, engineering, engineering simulation, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Fluid interface manipulation, high-performance, high-performance computing (HPC), Icepak, Latest News, Milwaukee, Milwaukee, Wisconsin, United, Milwaukee, Wisconsin, United States, MULTIPHYSICS, optiSLang, Predictive Thermal Design, product design, rapid prototyping, sensors, simulation, software subsystems, United States, Upcoming ANSYS Conference, Upcoming Conference, Wisconsin

Simulation Summit – Simulation, the Internet of Things and the Digital Twin Conference – September 7, 2017, Milwaukee, Wisconsin, United States

September 4, 2017 — 0 Comments

3D Manufacturing, 3D Printer, 3D printing, Additive Manufacturing, Additive Manufacturing (AM), Additive Manufacturing Conference, Aerodynamics, aerospace, Aerospace Enthusiasts, ANSYS, ANSYS ACT, ANSYS AIM, ANSYS Aqwa, ANSYS Electronics Desktop, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, ANSYS Workbench, Aqwa, Automotive Action, autonomous vehicles, battery modeling, battery technology, Breaking News, CAD, CAE, CAE-based design points, car body, CFD, CFD simulation, CFD simulation tool, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Defence, Defence Enthusiasts, Electro-Thermal Analysis, electro-thermal problems, Electronic Devices (ED), Electronics, engineering, engineering simulation, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Fluid interface manipulation, high-performance, high-performance computing (HPC), Latest News, Layton, Layton, Utah, Layton, Utah, United States, Mechanical, Mechanical CAD (MCAD), mechanical engineers, Metal 3D Printer, MULTIPHYSICS, optiSLang, Predictive Thermal Design, product design, Product Lifecycle Management, rapid prototyping, RF/microwave components, Robust Design Optimization, Robust Design Optimization (RDO), simulation, system level design, United States, Upcoming ANSYS Conference, Upcoming Conference, Utah, Utah Aerospace and Defense Model-Based Engineering Conference

Utah Aerospace and Defense Model-Based Engineering Conference – September 6, 2017, Layton, Utah, United States

September 4, 2017 — 0 Comments

ANSYS, ANSYS AIM, ANSYS Aqwa, ANSYS Convergence Conference, ANSYS Convergence Regional Conference, ANSYS Convergence Regional Conference 2017, ANSYS Electronics Desktop, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, ANSYS Workbench, Aqwa, autonomous vehicles, battery modeling, battery technology, Bengaluru, India, Breaking News, CAD, CAE, CAE-based design points, CAM, CFD, CFD simulation, CFD simulation tool, chemical, Chip to Product, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, electrical, Electrical CAD (ECAD), Electrical Engineers, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, energy, engineering, engineering simulation, EnSight, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Flow generation, Fluid interface manipulation, half-billion cell models, high-performance, high-performance computing (HPC), Icepak, Latest News, Mechanical, Mechanical CAD (MCAD), mechanical engineers, medical applications, Medical Devices, MULTIPHYSICS, optiSLang, precision, Predictive Thermal Design, product design, Product Lifecycle Management, Product Lifecycle Management (PLM), Robust Design Optimization, Robust Design Optimization (RDO), simulation, software subsystems, Space, subsystems, system level design, transducer designs, Upcoming ANSYS Conference, Upcoming Conference

ANSYS Convergence Regional Conference 2017 – August 31, 2017, Bengaluru, India

August 29, 2017 — 0 Comments

14th Conference on Acoustofluidics, Acoustic, Acoustic Analysis, Acoustic Experimentation, Acoustic streaming, acoustofluidics, Acoustofluidics 2017, Acoustofluidics 2017 Conference, biological, Breaking News, bubble manipulation, CAE, CAE-based design points, California, CBMS, CFD, CFD simulation, CFD simulation tool, chemical, Chip to Product, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, Electronic Devices (ED), Electronics, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Flow generation, Flow generation mechanisms, Fluid interface manipulation, high-performance, high-performance computing (HPC), HPC, Latest News, Measuring Acoustic Waves,, medical applications, Microscale, Microscale acoustofluidics, MULTIPHYSICS, Nanoscale, Nanoscale acoustofluidics, Particle Manipulation, Predictive Thermal Design, product design, Robust Design Optimization, San Diego, San Diego, California, San Diego, California, United States, simulation, transducer designs, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming Conference

Acoustofluidics 2017 Conference – The 14th Conference on Acoustofluidics – August 28, 2017 – August 29, 2017 , San Diego, California, United States

August 29, 2017 — 0 Comments

3D Manufacturing, 3D Printer, 3D printing, Additive Manufacturing, Additive Manufacturing Conference, Atlantic Design & Manufacturing, Atlantic Design & Manufacturing Trade Show/EXPO & Conference, Breaking News, Conference, Enthusiasts, Jacob K. Javits Convention Center, Jacob K. Javits Convention Center, New York, NY, Latest News, materials handling, New York, NY, rapid prototyping, sensors, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, Upcoming Workshop, WORKSHOP

Atlantic Design & Manufacturing Trade Show/EXPO & Conference – June 13, 2017 – June 15, 2017, New York City, New York, United States

May 25, 2017 — 0 Comments

ANSYS, ANSYS AIM, ANSYS Electronics Desktop, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MECHANICAL, ANSYS Savant, ANSYS SpaceClaim, ANSYS SpaceClaim Direct Modeler, Breaking News, CAE, COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Conference, FEA, finite element analysis, finite element analysis (FEA), Latest News, Lynnwood, Lynnwood, Washington, Lynnwood, Washington, United States, United States, Upcoming ANSYS Conference, Upcoming Conference

ANSYS Pacific Northwest Innovation Conference – May 23, 2017, Lynnwood, Washington, United States

May 22, 2017 — 0 Comments