Category: Upcoming Conference

18 Posts

Aerodynamics, aerospace, Aerospace Enthusiasts, ANSYS, ANSYS ACT, ANSYS AIM, ANSYS Aqwa, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, Automotive Action, autonomous vehicles, battery modeling, battery technology, Breaking News, CAD, CAE, CAE-based design points, CFD, CFD simulation, CFD simulation tool, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), digital twins, electrical, Electrical Engineers, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, energy, engineering, engineering simulation, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Fluid interface manipulation, high-performance, high-performance computing (HPC), Icepak, Latest News, Milwaukee, Milwaukee, Wisconsin, United, Milwaukee, Wisconsin, United States, MULTIPHYSICS, optiSLang, Predictive Thermal Design, product design, rapid prototyping, sensors, simulation, software subsystems, United States, Upcoming ANSYS Conference, Upcoming Conference, Wisconsin

Simulation Summit – Simulation, the Internet of Things and the Digital Twin Conference – September 7, 2017, Milwaukee, Wisconsin, United States

3D Manufacturing, 3D Printer, 3D printing, Additive Manufacturing, Additive Manufacturing (AM), Additive Manufacturing Conference, Aerodynamics, aerospace, Aerospace Enthusiasts, ANSYS, ANSYS ACT, ANSYS AIM, ANSYS Aqwa, ANSYS Electronics Desktop, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, ANSYS Workbench, Aqwa, Automotive Action, autonomous vehicles, battery modeling, battery technology, Breaking News, CAD, CAE, CAE-based design points, car body, CFD, CFD simulation, CFD simulation tool, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Defence, Defence Enthusiasts, Electro-Thermal Analysis, electro-thermal problems, Electronic Devices (ED), Electronics, engineering, engineering simulation, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Fluid interface manipulation, high-performance, high-performance computing (HPC), Latest News, Layton, Layton, Utah, Layton, Utah, United States, Mechanical, Mechanical CAD (MCAD), mechanical engineers, Metal 3D Printer, MULTIPHYSICS, optiSLang, Predictive Thermal Design, product design, Product Lifecycle Management, rapid prototyping, RF/microwave components, Robust Design Optimization, Robust Design Optimization (RDO), simulation, system level design, United States, Upcoming ANSYS Conference, Upcoming Conference, Utah, Utah Aerospace and Defense Model-Based Engineering Conference

Utah Aerospace and Defense Model-Based Engineering Conference – September 6, 2017, Layton, Utah, United States

ANSYS, ANSYS AIM, ANSYS Aqwa, ANSYS Convergence Conference, ANSYS Convergence Regional Conference, ANSYS Convergence Regional Conference 2017, ANSYS Electronics Desktop, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, ANSYS Workbench, Aqwa, autonomous vehicles, battery modeling, battery technology, Bengaluru, India, Breaking News, CAD, CAE, CAE-based design points, CAM, CFD, CFD simulation, CFD simulation tool, chemical, Chip to Product, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, electrical, Electrical CAD (ECAD), Electrical Engineers, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, energy, engineering, engineering simulation, EnSight, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Flow generation, Fluid interface manipulation, half-billion cell models, high-performance, high-performance computing (HPC), Icepak, Latest News, Mechanical, Mechanical CAD (MCAD), mechanical engineers, medical applications, Medical Devices, MULTIPHYSICS, optiSLang, precision, Predictive Thermal Design, product design, Product Lifecycle Management, Product Lifecycle Management (PLM), Robust Design Optimization, Robust Design Optimization (RDO), simulation, software subsystems, Space, subsystems, system level design, transducer designs, Upcoming ANSYS Conference, Upcoming Conference

ANSYS Convergence Regional Conference 2017 – August 31, 2017, Bengaluru, India

14th Conference on Acoustofluidics, Acoustic, Acoustic Analysis, Acoustic Experimentation, Acoustic streaming, acoustofluidics, Acoustofluidics 2017, Acoustofluidics 2017 Conference, biological, Breaking News, bubble manipulation, CAE, CAE-based design points, California, CBMS, CFD, CFD simulation, CFD simulation tool, chemical, Chip to Product, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, Electronic Devices (ED), Electronics, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Flow generation, Flow generation mechanisms, Fluid interface manipulation, high-performance, high-performance computing (HPC), HPC, Latest News, Measuring Acoustic Waves,, medical applications, Microscale, Microscale acoustofluidics, MULTIPHYSICS, Nanoscale, Nanoscale acoustofluidics, Particle Manipulation, Predictive Thermal Design, product design, Robust Design Optimization, San Diego, San Diego, California, San Diego, California, United States, simulation, transducer designs, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming Conference

Acoustofluidics 2017 Conference – The 14th Conference on Acoustofluidics – August 28, 2017 – August 29, 2017 , San Diego, California, United States

3D Manufacturing, 3D Printer, 3D printing, Additive Manufacturing, Additive Manufacturing Conference, Atlantic Design & Manufacturing, Atlantic Design & Manufacturing Trade Show/EXPO & Conference, Breaking News, Conference, Enthusiasts, Jacob K. Javits Convention Center, Jacob K. Javits Convention Center, New York, NY, Latest News, materials handling, New York, NY, rapid prototyping, sensors, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, Upcoming Workshop, WORKSHOP

Atlantic Design & Manufacturing Trade Show/EXPO & Conference – June 13, 2017 – June 15, 2017, New York City, New York, United States

ANSYS, ANSYS AIM, ANSYS Electronics Desktop, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MECHANICAL, ANSYS Savant, ANSYS SpaceClaim, ANSYS SpaceClaim Direct Modeler, Breaking News, CAE, COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Conference, FEA, finite element analysis, finite element analysis (FEA), Latest News, Lynnwood, Lynnwood, Washington, Lynnwood, Washington, United States, United States, Upcoming ANSYS Conference, Upcoming Conference

ANSYS Pacific Northwest Innovation Conference – May 23, 2017, Lynnwood, Washington, United States