Tag: Analysis

47 Posts

Analysis, Breaking News, CAD, CAE, CAE-based design points, CAEfatigue, CAEfatigue Ltd, COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Design of Experiments, Design of Experiments (DOE), DOE, engineering, engineering simulation, Fatigue, Fatigue Analysis, fatigue life, FEA, finite element analysis, finite element analysis (FEA), high-performance, high-performance computing (HPC), High-Performance Racing, HPC, Mechanical, Mechanical CAD (MCAD), mechanical engineers, MSC Nastran, MSC Nastran SOL 400, MSC Nastran SOL 400 Webinar, MSC Nastran Webinar, MSC One, MSC Software, MSC Software Webinar, NEVF, NEVF file, optimization, Optimization Technology, Power Spectral Density, precision, product design, PSDs (Power Spectral Density), Random Response, Random Response analysis, rapid prototyping, Robust Design Optimization, simulation, SOL 400, SOL 400 Webinar, solvers, system level design, technology, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming MSC Nastran, Upcoming MSC Nastran SOL 400, Upcoming MSC Software Webinar, Upcoming SOL 400, Upcoming Webinar, virtual prototyping,, webinar

100x Faster Durability Studies with MSC Nastran Embedded Vibration Fatigue NEVF (MSC Nastran is available in MSC One) Webinar – Thursday, October 5, 2017

ANSYS, ANSYS MECHANICAL, ANSYS Multiphysics, ANSYS optiSLang, ANSYS optiSLang Webinar, ANSYS Simulation, ANSYS Simulations, ANSYS webinar, ANSYS Workbench, Automotive Action, autonomous vehicles, CAD, CAE, CAE-based design points, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Data Center, data center designs, Design of Experiments, Design of Experiments (DOE), Design of Experiments (DOE) technology, DOE, Dynardo, Dynardo - dynamic software & engineering, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Mechanical, Mechanical CAD (MCAD), mechanical engineers, optiSLang, optiSLang Webinar, product design, rapid prototyping, Robust Design Optimization, Robust Design Optimization (RDO), simulation, solvers, subsystems, system level design, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Dimensioning and quality proof of a connector using ANSYS optiSLang Webinar – October 4, 2017

ANSYS, ANSYS Electronics Desktop, ANSYS PathFinder, ANSYS PathFinder Webinar, ANSYS webinar, ANSYS Workbench, Breaking News, CAD, CAE, CAE-based design points, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Electro-Thermal Analysis, electromigration, electromigration (EM), Electronic Devices (ED), Electronics, electrostatic discharge, electrostatic discharge (ESD), energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Predictive Thermal Design, product design, Product Lifecycle Management, Robust Design Optimization, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Thermal, EM and ESD Reliability Signoff for Next Generation FinFET Designs Webinar – September 27, 2017

ANSYS, ANSYS AIM, ANSYS MECHANICAL, ANSYS Mechanical structural analysis, ANSYS webinar, ANSYS Workbench, Automotive Action, Breaking News, CAD, CAE, CAE-based design points, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), EDEM, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Heavy Equipment Design, materials handling, Mechanical, Mechanical CAD (MCAD), mechanical engineers, precision, product design, simulation, software subsystems, Statistical Software, subsystems, Upcoming ANSYS Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

EDEM : Adding realistic loads in ANSYS FEA with bulk material simulation Webinar – Thursday, 14 September, 2017

14th Conference on Acoustofluidics, Acoustic, Acoustic Analysis, Acoustic Experimentation, Acoustic streaming, acoustofluidics, Acoustofluidics 2017, Acoustofluidics 2017 Conference, biological, Breaking News, bubble manipulation, CAE, CAE-based design points, California, CBMS, CFD, CFD simulation, CFD simulation tool, chemical, Chip to Product, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, Electronic Devices (ED), Electronics, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Flow generation, Flow generation mechanisms, Fluid interface manipulation, high-performance, high-performance computing (HPC), HPC, Latest News, Measuring Acoustic Waves,, medical applications, Microscale, Microscale acoustofluidics, MULTIPHYSICS, Nanoscale, Nanoscale acoustofluidics, Particle Manipulation, Predictive Thermal Design, product design, Robust Design Optimization, San Diego, San Diego, California, San Diego, California, United States, simulation, transducer designs, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming Conference

Acoustofluidics 2017 Conference – The 14th Conference on Acoustofluidics – August 28, 2017 – August 29, 2017 , San Diego, California, United States

ANSYS, ANSYS App Webinar, ANSYS Electronics Desktop, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS Maxwell Webinar, ANSYS Multiphysics Webinar, ANSYS Q3D Extractor Webinar, ANSYS Simplorer, ANSYS Simplorer Webinar, ANSYS webinar, Breaking News, CAD, CAE, CAE-based design points, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), electrical, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), MULTIPHYSICS, sensors, simulation, Upcoming ANSYS ACT APP Webinar, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Conducted EMI Analysis Using ANSYS Tools Webinar – September 26, 2017

ANSYS, ANSYS Electronics Desktop, ANSYS HFSS, ANSYS HFSS Seminar, ANSYS MAXWELL, ANSYS Maxwell Seminar, Breaking News, Burlington, CAD, CAE, CAE-based design points, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Electro-Thermal Analysis, Electronic Devices (ED), Electronics, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), High Performance RF/Microwave Components, high-performance, Latest News, Massachusetts, RF/microwave components, United States, Upcoming ANSYS Maxwell Seminar, Upcoming ANSYS Savant Seminar, Upcoming ANSYS Seminar, Upcoming Seminar, Upcoming Seminar/Workshop, Upcoming Workshop

Electro-Thermal Analysis of High Performance RF/Microwave Components – Hands-on Workshop Seminar – August 29, 2017, Burlington, Massachusetts, USA