Tag: automotive

32 Posts

Advanced Highway and Traffic Management Technologies, application, applications, Association, automated driving simulation, automated driving systems, automated driving vehicle technology, Automotive Action, Automotive Manufacturer, automotive OEMs, Automotive Testing Expo North America 2017, Automotive, Industrial & Functional Safety, autonomous self-driving vehicles, autonomous vehicle research, Autonomous Vehicle Test & Development Symposium, Autonomous Vehicle Test & Development Symposium USA 2017, autonomous vehicles, Breaking News, car body, Cloud, cloud platform, corporations, designs, developers, driver assistance technologies, driverless vehicle testing, efficiency, embedded software, Embedded Software Development, embedded systems, emissions, energy, engineering, Engineers, Eureka PROMETHEUS Project, Fully Automated Driving Vehicle Technology, Fully Autonomous Self-Driving Vehicles, influence, Infrastructure, Innovation, Innovation Platform, innovative, Innovative Tactics, innovators, Internet of Things, Internet of Things (IoT), Latest News, Networking, Novi, Novi, Michigan, predictions, process management, processing methodologies, product design, software developers, software development, Software Integrations, software subsystems, Sophisticated Testing, Systems Engineers, technology, testing processes, Traffic Technology International magazine, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow/EXPO, Validation Processes

Autonomous Vehicle Test & Development Symposium Conference/EXPO – October 25, 2017 – October 26, 2017 – Novi, Michigan, United States

architecture developments, Arm community, Arm TechCon 2017, Arm TechCon 2017 Conference/Expo, Arm TechCon Conference/Expo, Arm technologies, Arm® TechCon, Automotive, Industrial & Functional Safety, battery life maximization, Breaking News, Cloud, cloud platform, communications protocols, Compilation Tools Languages, Computer Vision, Computer Vision, Machine Learning & Graphics, Conference, debug, digital data sources, digital signals, distributed analytics, eight-track program, Embedded Software Development, energy harvesting, engineering, Engineering Managers, Engineers, executive managers, Expert Experience Levels, exploit productive, Graphics, hardware engineers, heterogeneous systems, High-Efficiency Systems, high-performance, Innovation, innovative, Internet of Things, Internet of Things (IoT), Latest News, Linux/Android operating systems, machine learning algorithms, methodologies, Methodology, multicore software, Networking, Networking & Servers, performance tuning, processing methodologies, Protocols, Santa Clara, Santa Clara, California, United States, Servers, Silicon Design, software developers, software development, software subsystems, storage server platforms, Trust & Security, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, wearables systems design

Arm TechCon 2017 Conference/Expo – October 24, 2017 – October 26, 2017, Santa Clara, California, United States

Analysis, Automotive Manufacturer, automotive OEMs, CAD, CAE, CAE-based design points, Carbon Fiber Reinforced Plastic, Carbon Fiber Reinforced Plastic (CFRP), compression molding, compression molding process, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Design of Experiments, Design of Experiments (DOE), Design of Experiments (DOE) technology, Digimat technology, Digimat Webinar, e-Xstream, e-Xstream Engineering, e-Xstream Webinar, energy, engineering, Engineering Managers, engineering simulation, FEA, finite element analysis, Mechanical, Mechanical CAD (MCAD), mechanical engineers, Molding Process, MSC Digimat, MSC e-Xstream, MSC One, MSC Software, MSC Software - e-Xstream, MSC Software Webinar, MULTIPHYSICS, Multiphysics Webinar, precision, product design, Project Managers, simulation, software subsystems, solvers, subsystems, system level design, technology, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming MSC Software Webinar, webinar

Multi-Scale Modelling of Sheet Molding Compounds (SMC) Webinar – Thursday, October 19, 2017

ANSYS, ANSYS MECHANICAL, ANSYS Multiphysics, ANSYS optiSLang, ANSYS optiSLang Webinar, ANSYS Simulation, ANSYS Simulations, ANSYS webinar, ANSYS Workbench, Automotive Action, autonomous vehicles, CAD, CAE, CAE-based design points, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Data Center, data center designs, Design of Experiments, Design of Experiments (DOE), Design of Experiments (DOE) technology, DOE, Dynardo, Dynardo - dynamic software & engineering, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Mechanical, Mechanical CAD (MCAD), mechanical engineers, optiSLang, optiSLang Webinar, product design, rapid prototyping, Robust Design Optimization, Robust Design Optimization (RDO), simulation, solvers, subsystems, system level design, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Dimensioning and quality proof of a connector using ANSYS optiSLang Webinar – October 4, 2017

Breaking News, CAD, CAE, CAE-based design points, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Design of Experiments, Design of Experiments (DOE), Design of Experiments (DOE) technology, DOE, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Mechanical, Mechanical CAD (MCAD), mechanical engineers, MSC Nastran, MSC Nastran SOL 400, MSC Nastran SOL 400 Webinar, MSC Nastran Webinar, MSC One, MSC Software, MSC Software Webinar, precision, product design, Product Lifecycle Management, Robust Design Optimization, Robust Design Optimization (RDO), simulation, software subsystems, SOL 400, SOL 400 Webinar, solvers, system level design, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming MSC Adams Webinar, Upcoming MSC Nastran, Upcoming MSC Nastran SOL 400, Upcoming Webinar, virtual prototyping,, webinar

From Trial-and-Error to Optimized Design – MSC Nastran & Optimus (MSC Nastran is available in MSC One) Webinar – Thursday, September 21, 2017

ANSYS, ANSYS Electronics Desktop, ANSYS PathFinder, ANSYS PathFinder Webinar, ANSYS webinar, ANSYS Workbench, Breaking News, CAD, CAE, CAE-based design points, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Electro-Thermal Analysis, electromigration, electromigration (EM), Electronic Devices (ED), Electronics, electrostatic discharge, electrostatic discharge (ESD), energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Predictive Thermal Design, product design, Product Lifecycle Management, Robust Design Optimization, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Thermal, EM and ESD Reliability Signoff for Next Generation FinFET Designs Webinar – September 27, 2017

ANSYS, ANSYS MAXWELL, ANSYS Maxwell Seminar, ANSYS Seminar., Breaking News, CAD, CAE, CAE-based design points, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), electrical, Electronics, engineering, engineering simulation, Latest News, product design, Pune, India, Seminar, simulation, Upcoming ANSYS Maxwell Seminar, Upcoming ANSYS Seminar, Upcoming Seminar, Upcoming Seminar/Workshop

Engineering Simulation for Electronics and Electrical Product Design Seminar – August 11, 2017, Pune, India