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Tag: designing

14 Posts

ANSYS, ANSYS FLUENT, ANSYS Fluent Webinar, ANSYS Maxwell 3D, ANSYS Maxwell Webinar, ANSYS Multiphysics, ANSYS Multiphysics Webinar, ANSYS webinar, application, CAE, CFD, CFD models, CFD simulation, CFD simulation tool, designs, efficiency, Electronic Devices (ED), Electronic Equipment, energy, engineering data, Engineering Postprocessing, engineering simulation, Engineers, finite element analysis (FEA), Latest News, mechanical parts, optimization, predictions, Predictive Thermal Design, simulation, simulation data, testing processes, Upcoming ANSYS Fluent Webinar, Upcoming ANSYS Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Optimizing Thermal Design in Electrical Machines with Simulation April 17, 2018

March 25, 2018 — 0 Comments

Analysis, ANSYS, ANSYS 18, ANSYS Electronics Desktop, ANSYS HFSS, ANSYS HFSS webinar, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS Maxwell Webinar, ANSYS Multiphysics, ANSYS Simulation, ANSYS Simulations, ANSYS webinar, ANSYS Workbench, antenna, Antenna Applications, Antenna Simulation, Antennas and Propagation (AP), Breaking News, CAD, CAE, CAE analysts, CAE-based design points, CAE/CAD Integration, complexity, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), designs, developers, digital data sources, digital signals, electrical, Electrical CAD (ECAD), Electrical Engineers, Electro-Thermal Analysis, Electromagnetic Compatibility (EMC), Electromagnetics, electromigration, electromigration (EM), Electronic Devices (ED), Electronics, Electronics 18.0 simulations, emissions, energy, engineering, engineering simulation, engineering simulations, FEA, finite element analysis, finite element analysis (FEA), FLUENT, HFSS 18, High Performance RF/Microwave Components, high-performance, MULTIPHYSICS, Multiphysics Webinar, precision, product design, radio frequency interference, radio frequency interference (RFI), RF, RF emissions, RF Module, RF transceivers, RF/microwave components, RFI, RFI issues, simulation, simulation data, solvers, Transceivers, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Interference-Free Design of Electronic Devices Webinar – Tuesday, November 07, 2017

October 22, 2017 — 0 Comments

Analysis, Automotive Manufacturer, automotive OEMs, CAD, CAE, CAE-based design points, Carbon Fiber Reinforced Plastic, Carbon Fiber Reinforced Plastic (CFRP), compression molding, compression molding process, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Design of Experiments, Design of Experiments (DOE), Design of Experiments (DOE) technology, Digimat technology, Digimat Webinar, e-Xstream, e-Xstream Engineering, e-Xstream Webinar, energy, engineering, Engineering Managers, engineering simulation, FEA, finite element analysis, Mechanical, Mechanical CAD (MCAD), mechanical engineers, Molding Process, MSC Digimat, MSC e-Xstream, MSC One, MSC Software, MSC Software - e-Xstream, MSC Software Webinar, MULTIPHYSICS, Multiphysics Webinar, precision, product design, Project Managers, simulation, software subsystems, solvers, subsystems, system level design, technology, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming MSC Software Webinar, webinar

Multi-Scale Modelling of Sheet Molding Compounds (SMC) Webinar – Thursday, October 19, 2017

October 18, 2017 — 0 Comments

ANSYS, ANSYS AIM, ANSYS MECHANICAL, ANSYS Mechanical structural analysis, ANSYS webinar, ANSYS Workbench, Automotive Action, Breaking News, CAD, CAE, CAE-based design points, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), EDEM, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Heavy Equipment Design, materials handling, Mechanical, Mechanical CAD (MCAD), mechanical engineers, precision, product design, simulation, software subsystems, Statistical Software, subsystems, Upcoming ANSYS Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

EDEM : Adding realistic loads in ANSYS FEA with bulk material simulation Webinar – Thursday, 14 September, 2017

September 8, 2017 — 0 Comments

ANSYS, ANSYS AIM, ANSYS Aqwa, ANSYS Convergence Conference, ANSYS Convergence Regional Conference, ANSYS Convergence Regional Conference 2017, ANSYS Electronics Desktop, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, ANSYS Workbench, Aqwa, autonomous vehicles, battery modeling, battery technology, Bengaluru, India, Breaking News, CAD, CAE, CAE-based design points, CAM, CFD, CFD simulation, CFD simulation tool, chemical, Chip to Product, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, electrical, Electrical CAD (ECAD), Electrical Engineers, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, energy, engineering, engineering simulation, EnSight, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Flow generation, Fluid interface manipulation, half-billion cell models, high-performance, high-performance computing (HPC), Icepak, Latest News, Mechanical, Mechanical CAD (MCAD), mechanical engineers, medical applications, Medical Devices, MULTIPHYSICS, optiSLang, precision, Predictive Thermal Design, product design, Product Lifecycle Management, Product Lifecycle Management (PLM), Robust Design Optimization, Robust Design Optimization (RDO), simulation, software subsystems, Space, subsystems, system level design, transducer designs, Upcoming ANSYS Conference, Upcoming Conference

ANSYS Convergence Regional Conference 2017 – August 31, 2017, Bengaluru, India

August 29, 2017 — 0 Comments

Breaking News, CAD, CAE, CAE-based design points, Cold, Cold Forming, Cold Forming Webinar, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), forming, Latest News, Machining, precision, Precision Machining, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Warming Up to Cold Forming: An Alternative to Precision Machining? Webinar – Tuesday, August 8, 2017

July 19, 2017 — 0 Comments