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20th Annual Systems Engineering Conference, academic, application, applications, Association, Breaking News, Chief Scientists, Communities, Conference, Defense Programs, Design Verification, Electronic Systems Society, energy, engineering, Engineering Managers, Engineers, function, IEEE Aerospace, IEEE Systems Council, Industrial Association, Industry Leaders, Infrastructure, Innovation, innovative, Innovative Tactics, interactions, International Council on Systems Engineering, Latest News, Logistics, National Defense Industrial Association, NDIA, NDIA’s Annual Systems Engineering Conference, practical, Pragmatic, Program Managers, Project Managers, researchers, Springfield, Springfield,  Virginia, subsystems, Support, system level design, Systems Engineering, Systems Engineering Conference, Systems Engineers, Tactics, technology, Test, Test Communities, United States, Upcoming Conference, verification, Virginia, Warfighting Force

20th Annual Systems Engineering Conference – October 23, 2017 – October 26, 2017, Springfield, Virginia, United States

October 25, 2017 — 0 Comments

ANSYS, ANSYS AIM, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS MECHANICAL, ANSYS Multiphysics, ANSYS optiSLang, ANSYS PathFinder, ANSYS Savant, ANSYS SeaScape, ANSYS Seminar., ANSYS Simplorer, ANSYS Simulation, ANSYS Simulations, ANSYS SpaceClaim, ANSYS Workbench, Breaking News, CAD, CAE, CAE-based design points, CFD, CFD simulation, CFD simulation tool, Cloud, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Electro-Thermal Analysis, energy, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), France, high-performance, high-performance computing (HPC), HPC, HPC Cloud, Latest News, Mechanical, Mechanical CAD (MCAD), mechanical engineers, MULTIPHYSICS, Paris, France, precision, Predictive Thermal Design, product design, Product Lifecycle Management, rapid prototyping, Seminar, simulation, software subsystems, subsystems, system level design, Upcoming ANSYS Seminar, Upcoming Seminar, Upcoming Seminar/Workshop, Upcoming Workshop, WORKSHOP

Engineering Simulation on the Cloud Seminar/Workshop in Paris, France – September 27, 2017

September 27, 2017 — 0 Comments

Aerodynamics, aerospace, Aerospace Enthusiasts, ANSYS, ANSYS ACT, ANSYS AIM, ANSYS Aqwa, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, Automotive Action, autonomous vehicles, battery modeling, battery technology, Breaking News, CAD, CAE, CAE-based design points, CFD, CFD simulation, CFD simulation tool, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), digital twins, electrical, Electrical Engineers, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, energy, engineering, engineering simulation, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Fluid interface manipulation, high-performance, high-performance computing (HPC), Icepak, Latest News, Milwaukee, Milwaukee, Wisconsin, United, Milwaukee, Wisconsin, United States, MULTIPHYSICS, optiSLang, Predictive Thermal Design, product design, rapid prototyping, sensors, simulation, software subsystems, United States, Upcoming ANSYS Conference, Upcoming Conference, Wisconsin

Simulation Summit – Simulation, the Internet of Things and the Digital Twin Conference – September 7, 2017, Milwaukee, Wisconsin, United States

September 4, 2017 — 0 Comments