Tag: United States

37 Posts

Advanced Highway and Traffic Management Technologies, application, applications, Association, automated driving simulation, automated driving systems, automated driving vehicle technology, Automotive Action, Automotive Manufacturer, automotive OEMs, Automotive Testing Expo North America 2017, Automotive, Industrial & Functional Safety, autonomous self-driving vehicles, autonomous vehicle research, Autonomous Vehicle Test & Development Symposium, Autonomous Vehicle Test & Development Symposium USA 2017, autonomous vehicles, Breaking News, car body, Cloud, cloud platform, corporations, designs, developers, driver assistance technologies, driverless vehicle testing, efficiency, embedded software, Embedded Software Development, embedded systems, emissions, energy, engineering, Engineers, Eureka PROMETHEUS Project, Fully Automated Driving Vehicle Technology, Fully Autonomous Self-Driving Vehicles, influence, Infrastructure, Innovation, Innovation Platform, innovative, Innovative Tactics, innovators, Internet of Things, Internet of Things (IoT), Latest News, Networking, Novi, Novi, Michigan, predictions, process management, processing methodologies, product design, software developers, software development, Software Integrations, software subsystems, Sophisticated Testing, Systems Engineers, technology, testing processes, Traffic Technology International magazine, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow/EXPO, Validation Processes

Autonomous Vehicle Test & Development Symposium Conference/EXPO – October 25, 2017 – October 26, 2017 – Novi, Michigan, United States

architecture developments, Arm community, Arm TechCon 2017, Arm TechCon 2017 Conference/Expo, Arm TechCon Conference/Expo, Arm technologies, Arm® TechCon, Automotive, Industrial & Functional Safety, battery life maximization, Breaking News, Cloud, cloud platform, communications protocols, Compilation Tools Languages, Computer Vision, Computer Vision, Machine Learning & Graphics, Conference, debug, digital data sources, digital signals, distributed analytics, eight-track program, Embedded Software Development, energy harvesting, engineering, Engineering Managers, Engineers, executive managers, Expert Experience Levels, exploit productive, Graphics, hardware engineers, heterogeneous systems, High-Efficiency Systems, high-performance, Innovation, innovative, Internet of Things, Internet of Things (IoT), Latest News, Linux/Android operating systems, machine learning algorithms, methodologies, Methodology, multicore software, Networking, Networking & Servers, performance tuning, processing methodologies, Protocols, Santa Clara, Santa Clara, California, United States, Servers, Silicon Design, software developers, software development, software subsystems, storage server platforms, Trust & Security, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, wearables systems design

Arm TechCon 2017 Conference/Expo – October 24, 2017 – October 26, 2017, Santa Clara, California, United States

20th Annual Systems Engineering Conference, academic, application, applications, Association, Breaking News, Chief Scientists, Communities, Conference, Defense Programs, Design Verification, Electronic Systems Society, energy, engineering, Engineering Managers, Engineers, function, IEEE Aerospace, IEEE Systems Council, Industrial Association, Industry Leaders, Infrastructure, Innovation, innovative, Innovative Tactics, interactions, International Council on Systems Engineering, Latest News, Logistics, National Defense Industrial Association, NDIA, NDIA’s Annual Systems Engineering Conference, practical, Pragmatic, Program Managers, Project Managers, researchers, Springfield, Springfield,  Virginia, subsystems, Support, system level design, Systems Engineering, Systems Engineering Conference, Systems Engineers, Tactics, technology, Test, Test Communities, United States, Upcoming Conference, verification, Virginia, Warfighting Force

20th Annual Systems Engineering Conference – October 23, 2017 – October 26, 2017, Springfield, Virginia, United States

accelerator, accelerator programs, ANSYS, ANSYS 18, Brand & Retail, Breaking News, co-working space, corporate innovation, corporate partners, corporations, designs, developers, efficiency, energy, engineering, Engineers, Enthusiasts, entrepreneurs, Fintech, Food & Beverage, Global Innovation Platform, Industry Leaders, Innovation, Innovation Platform, innovators, investor, Latest News, Logistics, Material, materials handling, new materials, Packaging, Plug and Play Tech, Plug and Play Tech Center, Plug and Play Tech Center Fall Summit 2017, startups, Supply Chain, Supply Chain & Logistics, Sustainability, Trade Show / Expo, Tradeshows, Upcoming EXPO, Upcoming TradeShow, Upcoming TradeShow/EXPO, venture capitalists

Plug and Play Tech Center Fall Summit 2017 Tradeshows/Expo – October 24, 2017 – October 26, 2017

Aerodynamics, aerospace, Aerospace Enthusiasts, ANSYS, ANSYS ACT, ANSYS AIM, ANSYS Aqwa, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, Automotive Action, autonomous vehicles, battery modeling, battery technology, Breaking News, CAD, CAE, CAE-based design points, CFD, CFD simulation, CFD simulation tool, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), digital twins, electrical, Electrical Engineers, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, energy, engineering, engineering simulation, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Fluid interface manipulation, high-performance, high-performance computing (HPC), Icepak, Latest News, Milwaukee, Milwaukee, Wisconsin, United, Milwaukee, Wisconsin, United States, MULTIPHYSICS, optiSLang, Predictive Thermal Design, product design, rapid prototyping, sensors, simulation, software subsystems, United States, Upcoming ANSYS Conference, Upcoming Conference, Wisconsin

Simulation Summit – Simulation, the Internet of Things and the Digital Twin Conference – September 7, 2017, Milwaukee, Wisconsin, United States

3D Manufacturing, 3D Printer, 3D printing, Additive Manufacturing, Additive Manufacturing (AM), Additive Manufacturing Conference, Aerodynamics, aerospace, Aerospace Enthusiasts, ANSYS, ANSYS ACT, ANSYS AIM, ANSYS Aqwa, ANSYS Electronics Desktop, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, ANSYS Workbench, Aqwa, Automotive Action, autonomous vehicles, battery modeling, battery technology, Breaking News, CAD, CAE, CAE-based design points, car body, CFD, CFD simulation, CFD simulation tool, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Defence, Defence Enthusiasts, Electro-Thermal Analysis, electro-thermal problems, Electronic Devices (ED), Electronics, engineering, engineering simulation, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Fluid interface manipulation, high-performance, high-performance computing (HPC), Latest News, Layton, Layton, Utah, Layton, Utah, United States, Mechanical, Mechanical CAD (MCAD), mechanical engineers, Metal 3D Printer, MULTIPHYSICS, optiSLang, Predictive Thermal Design, product design, Product Lifecycle Management, rapid prototyping, RF/microwave components, Robust Design Optimization, Robust Design Optimization (RDO), simulation, system level design, United States, Upcoming ANSYS Conference, Upcoming Conference, Utah, Utah Aerospace and Defense Model-Based Engineering Conference

Utah Aerospace and Defense Model-Based Engineering Conference – September 6, 2017, Layton, Utah, United States

14th Conference on Acoustofluidics, Acoustic, Acoustic Analysis, Acoustic Experimentation, Acoustic streaming, acoustofluidics, Acoustofluidics 2017, Acoustofluidics 2017 Conference, biological, Breaking News, bubble manipulation, CAE, CAE-based design points, California, CBMS, CFD, CFD simulation, CFD simulation tool, chemical, Chip to Product, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Computer-Aided Manufacturing, Computer-Aided Manufacturing (CAM), Conference, Electronic Devices (ED), Electronics, energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Flow generation, Flow generation mechanisms, Fluid interface manipulation, high-performance, high-performance computing (HPC), HPC, Latest News, Measuring Acoustic Waves,, medical applications, Microscale, Microscale acoustofluidics, MULTIPHYSICS, Nanoscale, Nanoscale acoustofluidics, Particle Manipulation, Predictive Thermal Design, product design, Robust Design Optimization, San Diego, San Diego, California, San Diego, California, United States, simulation, transducer designs, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming CFD Webinar, Upcoming Conference

Acoustofluidics 2017 Conference – The 14th Conference on Acoustofluidics – August 28, 2017 – August 29, 2017 , San Diego, California, United States