Tag: validation

6 Posts

Analysis, ANSYS, ANSYS Simulation, ANSYS Simulations, ANSYS webinar, Breaking News, CAE, Computational Electromagnetics, COMPUTER-AIDED ENGINEERING (CAE), efficiency, electro-thermal problems, Electromagnetic Compatibility (EMC), Electromagnetics, Electronic Devices (ED), emissions, engineering, engineering simulation, Engineers, FEA, finite element analysis (FEA), MULTIPHYSICS, simulation, simulation data, Upcoming ANSYS Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

JOIN UPCOMING WEBINAR OF ANSYS -Computational-based MRI Thermal Injury Risk Assessment for Patients implanted with Passive Spinal Devices January 10, 2018

Aerodynamic Designs, Aeromechanical Simulation, Analysis, ANSYS, ANSYS 18, ANSYS AIM, ANSYS Conference, ANSYS Convergence Regional Conferences 2017, Ansys Discovery Live, ANSYS EnSight, ANSYS FEA, ANSYS FLUENT, ANSYS MECHANICAL, ANSYS Multiphysics, ANSYS SCADE, ANSYS Simulation, ANSYS Simulations, ANSYS Users, ANSYS Workbench, application, applications, Boundary Conditions, Breaking News, CAD, CAE, CAE analysts, CAE-based design points, CAE/CAD Integration, CFD, CFD models, CFD post-processing software, CFD simulation, CFD simulation tool, CFD workflows, Chip to Product, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, computational fluid dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Cooling, Cooling System, Design and Control Optimization, designs, DesignXplorer, Eindhoven, Eindhoven, Netherlands, electro-thermal problems, Electromagnetics, Electronic Devices (ED), Electronic Equipment, Electronics, Electronics 18.0 simulations, embedded software, Embedded Software Development, embedded systems, energy, engineering, Engineering Postprocessing, engineering simulation, engineering simulations, Engineers, FEA, finite element analysis, finite element analysis (FEA), Flow generation, FLUENT, FLUID DYNAMICS, Fluid interface manipulation, Flutter Predictions, future product development processes, Higher Simulation Productivity, Innovation, Innovation Platform, innovative, innovators, Latest News, Mechanical, mechanical engineers, mechanical parts, Netherlands, physics, Physics Influence, precision, Predictive Thermal Design, product design, SCADE, simulation, simulation data, software developers, software development, software subsystems, strength, structural, structural integrity simulation, structural optimization, structure behavior, Structure Behaviour, Turbomachinery Blade Design, Upcoming Conference, Upcoming Seminar/Workshop, Upcoming Workshop, Validation Processes, virtual prototyping,, Workbench

ANSYS Convergence Regional Conferences 2017 – October 27, 2017 -Eindhoven, The Netherlands

Advanced Highway and Traffic Management Technologies, application, applications, Association, automated driving simulation, automated driving systems, automated driving vehicle technology, Automotive Action, Automotive Manufacturer, automotive OEMs, Automotive Testing Expo North America 2017, Automotive, Industrial & Functional Safety, autonomous self-driving vehicles, autonomous vehicle research, Autonomous Vehicle Test & Development Symposium, Autonomous Vehicle Test & Development Symposium USA 2017, autonomous vehicles, Breaking News, car body, Cloud, cloud platform, corporations, designs, developers, driver assistance technologies, driverless vehicle testing, efficiency, embedded software, Embedded Software Development, embedded systems, emissions, energy, engineering, Engineers, Eureka PROMETHEUS Project, Fully Automated Driving Vehicle Technology, Fully Autonomous Self-Driving Vehicles, influence, Infrastructure, Innovation, Innovation Platform, innovative, Innovative Tactics, innovators, Internet of Things, Internet of Things (IoT), Latest News, Networking, Novi, Novi, Michigan, predictions, process management, processing methodologies, product design, software developers, software development, Software Integrations, software subsystems, Sophisticated Testing, Systems Engineers, technology, testing processes, Traffic Technology International magazine, United States, Upcoming Conference, Upcoming EXPO, Upcoming TradeShow/EXPO, Validation Processes

Autonomous Vehicle Test & Development Symposium Conference/EXPO – October 25, 2017 – October 26, 2017 – Novi, Michigan, United States

ANSYS, ANSYS Electronics Desktop, ANSYS PathFinder, ANSYS PathFinder Webinar, ANSYS webinar, ANSYS Workbench, Breaking News, CAD, CAE, CAE-based design points, COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), Electro-Thermal Analysis, electromigration, electromigration (EM), Electronic Devices (ED), Electronics, electrostatic discharge, electrostatic discharge (ESD), energy, engineering, engineering simulation, FEA, finite element analysis, finite element analysis (FEA), Predictive Thermal Design, product design, Product Lifecycle Management, Robust Design Optimization, Upcoming ANSYS Webinar, Upcoming CAD Webinar, Upcoming CAE Webinar, Upcoming FEA Webinar, Upcoming Webinar, webinar

Thermal, EM and ESD Reliability Signoff for Next Generation FinFET Designs Webinar – September 27, 2017

Aerodynamics, aerospace, Aerospace Enthusiasts, ANSYS, ANSYS ACT, ANSYS AIM, ANSYS Aqwa, ANSYS EnSight, ANSYS EnVision, ANSYS FLUENT, ANSYS HFSS, ANSYS Icepak, ANSYS MAXWELL, ANSYS Maxwell 3D, ANSYS MECHANICAL, ANSYS optiSLang, ANSYS Savant, ANSYS SeaScape, ANSYS Simplorer, ANSYS SpaceClaim, Automotive Action, autonomous vehicles, battery modeling, battery technology, Breaking News, CAD, CAE, CAE-based design points, CFD, CFD simulation, CFD simulation tool, Computational Electromagnetics, Computational Electromagnetics and Fluid Dynamics, Computational Fluid Dynamics (CFD), COMPUTER-AIDED DESIGN, COMPUTER-AIDED DESIGN (CAD), COMPUTER-AIDED ENGINEERING, COMPUTER-AIDED ENGINEERING (CAE), digital twins, electrical, Electrical Engineers, Electro-Thermal Analysis, electro-thermal problems, Electromagnetic Compatibility (EMC), Electronic Devices (ED), Electronics, embedded software, embedded systems, energy, engineering, engineering simulation, Enthusiasts, FEA, finite element analysis, finite element analysis (FEA), Fluid interface manipulation, high-performance, high-performance computing (HPC), Icepak, Latest News, Milwaukee, Milwaukee, Wisconsin, United, Milwaukee, Wisconsin, United States, MULTIPHYSICS, optiSLang, Predictive Thermal Design, product design, rapid prototyping, sensors, simulation, software subsystems, United States, Upcoming ANSYS Conference, Upcoming Conference, Wisconsin

Simulation Summit – Simulation, the Internet of Things and the Digital Twin Conference – September 7, 2017, Milwaukee, Wisconsin, United States