ANSYS Electronics Innovation Conference 


Check new Conference of – ANSYS Electronics Innovation Conference

Date –  May 17, 2017, Time – 8:30 AM – 3:30 PM (EST)

Venue – Brookstreet Hotel, 525 Legget Dr, Kanata, ON K2K 2W2, Canada

Speaker – Amit Shah ( )

Cost –  ANSYS Electronics Innovation Conference 

Link – ANSYS Electronics Innovation Conference 

Details –


At the ANSYS Electronics Innovation Conference, engineering experts will help you to focus on improving electronic systems by sharing design and simulation best practices. The conference aims to bring together the engineering community in Ottawa to provide a platform to discuss innovations and facilitate networking. During multiple sessions, you will gain insight into key challenges in RF/microwave and PCB design, such as signal and power integrity, thermal analysis, and learn how to address them using simulation and product development best practices.

About Conference –



08:30-09:00  Registration and Breakfast
09:00-09:15 ANSYS Welcome / Introduction
09:15- 09:45 Keynote – It’s About Interconnect
– Hugues Tournier, Ciena
9:45-10:15 Keynote – Challenges in Power Electronic Packaging. A GaN perspective.
– Edward MacRobbie, GaN Systems
10:15-10:45 Coffee Break
RF & Microwave Signal & Power Integrity  Mechanical / Thermal 
10:45-11:30 The Mutiple Coupled Physics Impact on Microwave Design
Electrical & Thermal Analysis of Printed Circuit Board
Electronic PCB and Package Thermal Stress Analysis
11:30-12:15 Dual-band Millimeter-Wave Interleaved Antenna Array Exploiting Low-cost PCB Technology for High Speed 5G Communication
– Huawei
Signal Integrity and Power Integrity Analysis
– Synopsys
Shock, Vibration and Thermal analysis
– Lumentum
12:15-1:15 Lunch
13:15-14:00 Dual Band Multi-beam Base Station Antenna
– CCI Products
EMI Analysis of Full Vehicle Electronic Systems
Silicon Die Metal Self Heating Analysis
– Synopsys
14:00-14:45 AIM: A New Approach to Multiphysics for Design Engineers
14:45-15:00 Coffee Break
15:00-15:30 Multiphysics Simulation of the Challenges Facing Commercial Air Package Delivery Systems
Microelectronic Device Thermal Mechanical Simulation
– GaN Systems