ANSYS Electronics Innovation Conference
Check new Conference of – ANSYS Electronics Innovation Conference
Date – May 17, 2017, Time – 8:30 AM – 3:30 PM (EST)
Venue – Brookstreet Hotel, 525 Legget Dr, Kanata, ON K2K 2W2, Canada
Speaker – Amit Shah ( amit.shah@ansys.com )
Cost – ANSYS Electronics Innovation Conference
Link – ANSYS Electronics Innovation Conference
Details –
At the ANSYS Electronics Innovation Conference, engineering experts will help you to focus on improving electronic systems by sharing design and simulation best practices. The conference aims to bring together the engineering community in Ottawa to provide a platform to discuss innovations and facilitate networking. During multiple sessions, you will gain insight into key challenges in RF/microwave and PCB design, such as signal and power integrity, thermal analysis, and learn how to address them using simulation and product development best practices.
About Conference –
Agenda
| 08:30-09:00 | Registration and Breakfast | ||
| 09:00-09:15 | ANSYS Welcome / Introduction | ||
| 09:15- 09:45 | Keynote – It’s About Interconnect – Hugues Tournier, Ciena |
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| 9:45-10:15 | Keynote – Challenges in Power Electronic Packaging. A GaN perspective. – Edward MacRobbie, GaN Systems |
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| 10:15-10:45 | Coffee Break | ||
| RF & Microwave | Signal & Power Integrity | Mechanical / Thermal | |
| 10:45-11:30 | The Mutiple Coupled Physics Impact on Microwave Design – ANSYS |
Electrical & Thermal Analysis of Printed Circuit Board – ANSYS |
Electronic PCB and Package Thermal Stress Analysis – ANSYS |
| 11:30-12:15 | Dual-band Millimeter-Wave Interleaved Antenna Array Exploiting Low-cost PCB Technology for High Speed 5G Communication – Huawei |
Signal Integrity and Power Integrity Analysis – Synopsys |
Shock, Vibration and Thermal analysis – Lumentum |
| 12:15-1:15 | Lunch | ||
| 13:15-14:00 | Dual Band Multi-beam Base Station Antenna – CCI Products |
EMI Analysis of Full Vehicle Electronic Systems – ANSYS |
Silicon Die Metal Self Heating Analysis – Synopsys |
| 14:00-14:45 | AIM: A New Approach to Multiphysics for Design Engineers – ANSYS |
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| 14:45-15:00 | Coffee Break | ||
| 15:00-15:30 | Multiphysics Simulation of the Challenges Facing Commercial Air Package Delivery Systems – ANSYS |
Microelectronic Device Thermal Mechanical Simulation – GaN Systems |
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